BGA упаковка
Minimal BGA package – тип корпусирования поверхностно-монтируемых интегральных микросхем (англ. Ball grid array — массив шариков), разработанный консорциумом Minimal Fab. Полная линейка Minimal BGA package состоит из 14 устройств в форм-факторе Minimal. BGA выводы представляют собой шарики из припоя, нанесённые на контактные площадки с обратной стороны микросхемы.
Рис. 1. Фотография технологической процесса BGA упаковки.
Рис. 2. Фото BGA упаковки в сечении и общий вид.
Рис. 3. Фотография технологической линии Minimal Fab по упаковке BGA в AIST.
Литература:
1. Yasuhide Higashino, Fumito Imura, Michihiro Inoue, Arami Saruwatari, Sommawan Khumpuang, Shiro Hara. Application of lithography in MINIMAL Package. Proceedings of the 76th JSAP Autumn Meeting, 2015, 12-034.
2. Fumito IMURA, Yasuhide HIGASHINO, Koyu HOCHI, Yuji KITAYAMA, Junko KAZUSA, Michihiro INOUE, Arami SARUWATARI, Sommawan KHUMPUANG and Shiro HARA. Wafer-Packaging System Integrating with Electronic Device Manufacturing Line for a Half-Inch Wafer. Journal of Smart Process, 2016, Vol.5, No.5, p.280.
3. Michihiro Inoue, Fumito Imura, Arami Saruwatari, Shiro Hara. Packaging in Minimal Fab: An integrated semiconductor line from wafer process to packaging process. International Conference on IC Design and Technology (ICICDT), 2016.
4. Sommawan Khumpuang, Fumito Imura, Shiro Hara. BGA Packaging process for a Device made by Minimal Fab. IEEE Electron Devices Technology and Manufacturing Conference (EDTM), 2017, p.49.
5. Fumito Imura Michihiro Inoue, Arami Saruwatari, Sommawan Khumpuang, Shiro Hara. Development of Semiconductor Manufacturing System Integrating Wafer Process and Packaging Process Using a Half-Inch Sized Package. IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM), 2018, p. 227.
6. Fumito Imura, Michihiro Inoue, Sommawan Khumpuang, Shiro Hara. Via Interconnections for Half-Inch Sized Package Fabricated by Minimal Fab. 20th Electronics Packaging Technology Conference EPTC-2018, p.88-92.
7. Fumito IMURA, Sommawan KHUMPUANG, Hisatoshi HIRAI, Michihiro INOUE, Shiro HARA. Ultra-Compact Device-Manufacturing-System “Minimal Fab” Integrating Wafer and Packaging Process for High-Mix Low-Volume Productions and Its Packaging Applications. Journal of Electronics Packaging Society, Vol. 22 No. 6 (2019), p.507-513.